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Magazine Name : Microelectronics Journal

Year : 2003 Volume number : 34 Issue: 03

New Possibilities In The Thermal Evaluation, Offered By Transient Testing (Article)
Subject: Thermal Testing , Thermal Modeling
Author: Marta Rencz     
page:      171 - 177
Thermal Challenges In Mems Applications: Phase Change Phenomena And Thermal Bonding Processes (Article)
Subject: Bubble Shape , Thermal Bonding
Author: Liwei Lin     
page:      179 - 185
Innovative Wick Design For Multi-Source , Flat Plate Heat Pipes (Article)
Subject: Micro-Heat Pipe , Ic Cooling Technology
Author: M.J. Rightley     
page:      187 - 194
Dynamic Of A Liquid Plug In A Cappillary Duct Powered By Vapor Explosion (Article)
Subject: Liquid Plug
Author: Osamu Suzuki     
page:      195 - 200
Nonequilibirium Electron And Phonon Transport And Energy Conversion In Heterostructures (Article)
Subject: Heterostructure
Author: Taofang Zheng     
page:      201 - 206
A Study Of Temperature Field In A Gan Heterostructure Field-Effect Transistor (Article)
Subject: Gallium Nitride , Heterostructure
Author: Mirza B Baig     
page:      207 - 214
Performance And Testing Of Thermal Interface Materials (Article)
Subject: Thermal Interface Material , Thermal Interface Resistance
Author: Santiranjan R.     
page:      215 - 222
Evaalution Of Analytical Models For Thermal Analysis And Design Of Elkectronic Packages (Article)
Subject: Orthotropic Material
Author: S. Moghaddam     
page:      223 - 230